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From: =?utf-8?Q?Mirja_K=C3=BChlewind?= <mirja.kuehlewind@tik.ee.ethz.ch>
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Hi all,

we submitted (just before Christmas) a new draft proposing a common wire =
image for UDP substrates. Based on the previous discussion on the list, =
the proposal follows the simpler approach of using a random serial =
number and highest number echo for basic diagnostics. In addition, we =
discuss further diagnostic information that could be provided by an =
extended header without proposing a extended header format yet.=20
Stay tuned for further updates and please provide input or feedback! =
Thanks!

Happy new year!
Mirja


> Am 23.12.2016 um 15:28 schrieb internet-drafts@ietf.org:
>=20
>=20
> A new version of I-D, draft-trammell-plus-spec-00.txt
> has been successfully submitted by Brian Trammell and posted to the
> IETF repository.
>=20
> Name:		draft-trammell-plus-spec
> Revision:	00
> Title:		Path Layer UDP Substrate Specification
> Document date:	2016-12-23
> Group:		Individual Submission
> Pages:		13
> URL:            =
https://www.ietf.org/internet-drafts/draft-trammell-plus-spec-00.txt
> Status:         =
https://datatracker.ietf.org/doc/draft-trammell-plus-spec/
> Htmlized:       =
https://tools.ietf.org/html/draft-trammell-plus-spec-00
>=20
>=20
> Abstract:
>   This document specifies a common Path Layer UDP Substrate (PLUS) =
wire
>   image for encrypted transport protocols carried over UDP.  The base
>   PLUS header carries information for driving a minimal state machine
>   at middleboxes described in [I-D.trammell-plus-statefulness], and
>   provides optional exposure of additional information to devices =
along
>   the path using the mechanism described in
>   [I-D.trammell-plus-abstract-mech].
>=20
>=20
>=20
>=20
> Please note that it may take a couple of minutes from the time of =
submission
> until the htmlized version and diff are available at tools.ietf.org.
>=20
> The IETF Secretariat


From nobody Fri Jan  6 09:46:12 2017
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From: "Fossati, Thomas (Nokia - GB)" <thomas.fossati@nokia.com>
To: =?iso-8859-1?Q?Mirja_K=FChlewind?= <mirja.kuehlewind@tik.ee.ethz.ch>, "plus@ietf.org" <plus@ietf.org>
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Hi Mirja,

On 05/01/2017 10:44, "Plus on behalf of Mirja K=FChlewind"
<plus-bounces@ietf.org on behalf of mirja.kuehlewind@tik.ee.ethz.ch> wrote:
>we submitted (just before Christmas) a new draft proposing a common wire
>image for UDP substrates. Based on the previous discussion on the list,
>the proposal follows the simpler approach of using a random serial number
>and highest number echo for basic diagnostics. In addition, we discuss
>further diagnostic information that could be provided by an extended
>header without proposing a extended header format yet.
>Stay tuned for further updates and please provide input or feedback!
>Thanks!

I've just finished reading the draft and was extremely pleased to see the
LoLa bit in the basic header.  An end-to-end integrity-protected marking
is definitely better than DSCP.

It also look pretty straightforward to add a couple of PCFs to the
extended header to support MTG signalling, which is nice.

A few editorial nits:
Sec 2.1, second bullet: "When multiplexing, it must ensure the PSN is not
already in use for the 5-tuple." -- you probably mean CAT instead of PSN?
Sec 2.2, second bullet: "It verifies the integrity of the information in
the PLUS Basic Header, using information carried in the overlying
transport." -- it's not clear which "information carried in the overlying
transport" you are referring to.
Sec 2.3.1, first para -- a bit hard to parse.

One meta-comment: how do you think the use of PLUS is negotiated by the
endpoints?

Cheers, t


>Happy new year!
>Mirja
>
>
>> Am 23.12.2016 um 15:28 schrieb internet-drafts@ietf.org:
>>=20
>>=20
>> A new version of I-D, draft-trammell-plus-spec-00.txt
>> has been successfully submitted by Brian Trammell and posted to the
>> IETF repository.
>>=20
>> Name:		draft-trammell-plus-spec
>> Revision:	00
>> Title:		Path Layer UDP Substrate Specification
>> Document date:	2016-12-23
>> Group:		Individual Submission
>> Pages:		13
>> URL:           =20
>>https://www.ietf.org/internet-drafts/draft-trammell-plus-spec-00.txt
>> Status:        =20
>>https://datatracker.ietf.org/doc/draft-trammell-plus-spec/
>> Htmlized:       https://tools.ietf.org/html/draft-trammell-plus-spec-00
>>=20
>>=20
>> Abstract:
>>   This document specifies a common Path Layer UDP Substrate (PLUS) wire
>>   image for encrypted transport protocols carried over UDP.  The base
>>   PLUS header carries information for driving a minimal state machine
>>   at middleboxes described in [I-D.trammell-plus-statefulness], and
>>   provides optional exposure of additional information to devices along
>>   the path using the mechanism described in
>>   [I-D.trammell-plus-abstract-mech].
>>=20
>>=20
>>=20
>>=20
>> Please note that it may take a couple of minutes from the time of
>>submission
>> until the htmlized version and diff are available at tools.ietf.org.
>>=20
>> The IETF Secretariat
>
>_______________________________________________
>Plus mailing list
>Plus@ietf.org
>https://www.ietf.org/mailman/listinfo/plus
>



From nobody Mon Jan 23 09:41:59 2017
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Hi Thomas,

sorry for the late reply and thanks for the feedback!

See below!


> Am 06.01.2017 um 18:40 schrieb Fossati, Thomas (Nokia - GB) =
<thomas.fossati@nokia.com>:
>=20
> Hi Mirja,
>=20
> On 05/01/2017 10:44, "Plus on behalf of Mirja K=C3=BChlewind"
> <plus-bounces@ietf.org on behalf of mirja.kuehlewind@tik.ee.ethz.ch> =
wrote:
>> we submitted (just before Christmas) a new draft proposing a common =
wire
>> image for UDP substrates. Based on the previous discussion on the =
list,
>> the proposal follows the simpler approach of using a random serial =
number
>> and highest number echo for basic diagnostics. In addition, we =
discuss
>> further diagnostic information that could be provided by an extended
>> header without proposing a extended header format yet.
>> Stay tuned for further updates and please provide input or feedback!
>> Thanks!
>=20
> I've just finished reading the draft and was extremely pleased to see =
the
> LoLa bit in the basic header.  An end-to-end integrity-protected =
marking
> is definitely better than DSCP.
>=20
> It also look pretty straightforward to add a couple of PCFs to the
> extended header to support MTG signalling, which is nice.
>=20
> A few editorial nits:
> Sec 2.1, second bullet: "When multiplexing, it must ensure the PSN is =
not
> already in use for the 5-tuple." -- you probably mean CAT instead of =
PSN?

Fixed in md file in GitHub.

> Sec 2.2, second bullet: "It verifies the integrity of the information =
in
> the PLUS Basic Header, using information carried in the overlying
> transport." -- it's not clear which "information carried in the =
overlying
> transport" you are referring to.

The idea here would be that the overlaying transport would e.g. have a =
hash that could be used to verify the header information. Basically this =
is a question about how the interface to the crypto engine would look =
like and we deliberately stayed a bit vague here. Should probably refine =
this for the next version.=20

I=E2=80=99ve put an editor=E2=80=99s note in the md.

> Sec 2.3.1, first para -- a bit hard to parse.

Yes, that was broken. Fixed in the md now.

>=20
> One meta-comment: how do you think the use of PLUS is negotiated by =
the
> endpoints?

Yes, this needs further discussion. The most likely case will be =
out-of-band knowledge (I know that this server on this port speaks plus) =
but we might also want to think about other discovery mechanisms but =
those things might actually be use case/higher protocol dependent.

Mirja




>=20
> Cheers, t
>=20
>=20
>> Happy new year!
>> Mirja
>>=20
>>=20
>>> Am 23.12.2016 um 15:28 schrieb internet-drafts@ietf.org:
>>>=20
>>>=20
>>> A new version of I-D, draft-trammell-plus-spec-00.txt
>>> has been successfully submitted by Brian Trammell and posted to the
>>> IETF repository.
>>>=20
>>> Name:		draft-trammell-plus-spec
>>> Revision:	00
>>> Title:		Path Layer UDP Substrate Specification
>>> Document date:	2016-12-23
>>> Group:		Individual Submission
>>> Pages:		13
>>> URL:           =20
>>> https://www.ietf.org/internet-drafts/draft-trammell-plus-spec-00.txt
>>> Status:        =20
>>> https://datatracker.ietf.org/doc/draft-trammell-plus-spec/
>>> Htmlized:       =
https://tools.ietf.org/html/draft-trammell-plus-spec-00
>>>=20
>>>=20
>>> Abstract:
>>>  This document specifies a common Path Layer UDP Substrate (PLUS) =
wire
>>>  image for encrypted transport protocols carried over UDP.  The base
>>>  PLUS header carries information for driving a minimal state machine
>>>  at middleboxes described in [I-D.trammell-plus-statefulness], and
>>>  provides optional exposure of additional information to devices =
along
>>>  the path using the mechanism described in
>>>  [I-D.trammell-plus-abstract-mech].
>>>=20
>>>=20
>>>=20
>>>=20
>>> Please note that it may take a couple of minutes from the time of
>>> submission
>>> until the htmlized version and diff are available at tools.ietf.org.
>>>=20
>>> The IETF Secretariat
>>=20
>> _______________________________________________
>> Plus mailing list
>> Plus@ietf.org
>> https://www.ietf.org/mailman/listinfo/plus
>>=20
>=20

