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From: Geoff Mulligan <geoff@mulligan.com>
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Here is the current agenda...

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 IETF-64 6lowpan WG Agenda 
=============================

Time: Monday, November 07, 2005 1300-1500 Salon F

  Agenda bashing: 05 min
  Problem Statement: 15 min
  Format Document: 15 min
  Neighbor Discovery: 15 min
  On-Demand adhoc routing protocol for 6lowpan: 15 min
  Routing protocol comparison: 15 min
  6lowpan Evaluation results: 15 min
  Security Considerations: 10 min
  Zigbee and Interoperability Considerations: 15 min
  

Chair(s):
Geoff Mulligan <geoff.mulligan@invensyscontrols.com>
Carsten Bormann <cabo@tzi.de>

Internet Area Director(s):
Mark Townsley <townsley@cisco.com>
Margaret Wasserman <margaret@thingmagic.com>

Internet Area Advisor:
Margaret Wasserman <margaret@thingmagic.com>

Mailing Lists:
General Discussion: 6lowpan@lists.ietf.org
To Subscribe: 6lowpan-request@lists.ietf.org
Archive: https://www1.ietf.org/mailman/listinfo/6lowpan

Description of Working Group:

Background/Introduction:

     Note: Given that there is not much precedent for this type of
     activity at the IETF, the text that follows is of an introductory
     nature. Hence, its objective is to give a general idea of the
     application area and motivations for the work. In particular,
     this section is not to be construed as detailing work items for
     the working group. That is done in the following section entitled
     "Scope of the Working Group."

Well-established fields such as control networks, and burgeoning ones
such as "sensor" (or transducer) networks, are increasingly being
based on wireless technologies. Most (but certainly not all) of these
nodes are amongst the most constrained that have ever been networked
wirelessly. Extreme low power (such that they will run potentially for
years on batteries) and extreme low cost (total device cost in single
digit dollars, and riding Moore's law to continuously reduce that
price point) are seen as essential enablers towards their deployment
in networks with the following characteristics:

   * Significantly more devices than current networks

   * Severely limited code and ram space (e.g., highly desirable to
     fit the required code--MAC, IP and anything else needed to
     execute the embedded application-- in, for example, 32K of flash
     memory, using 8-bit microprocessors)

   * Unobtrusive but very different user interface for configuration
     (e.g., using gestures or interactions involving the physical
     world)

   * Robustness and simplicity in routing or network fabric

A chief component of these devices is wireless communication
technology. In particular, the IEEE 802.15.4 standard is very
promising for the lower (physical and link) layers. As for higher
layer functions, there is considerable interest from non-IETF groups
in using IP technology (the ZigBee alliance, for example, is currently
studying what such a work item might entail). The working group is
expected to coordinate and interact with such groups.

The required work includes items in the following (incomplete) list:

   * IP adaptation/Packet Formats and interoperability
   * Addressing schemes and address management
   * Network management
   * Routing in dynamically adaptive topologies
   * Security, including set-up and maintenance
   * Application programming interface
   * Discovery (of devices, of services, etc)
   * Implementation considerations

Whereas at least some of the above items are within the purview of the
IETF, at this point it is not clear that all of them are. Accordingly,
the 6LoWPAN working group will address a reduced, more focused set of
objectives.

Scope of 6lowpan:

Produce "Problems Statement, Assumptions and Goals for IPv6 for
LoWPANs" (draft-ietf-lowpan-goals-assumptions-xx.txt) to define the
problem statement and goals of 6lowpan networks.

Produce "Transmission of IPv6 Packets over IEEE 802.15.4 WPAN
Networks" (draft-ietf-lowpan-ipv6-over-802.15.4-xx.txt) to define the
basic packet formats and sub-IP adaptation layer for transmission of
IPv6 packets over IEEE 802.15.4. This includes framing, adaptation,
header compression and address generation. Furthermore, IEEE 802.15.4
devices are expected to be deployed in mesh topologies.

As such, the working group may also work on an informational document
to show how to apply an existing MANET protocol to LoWPANs (e.g.,
AODV, OLSR, DYMO, etc).

The working group will reuse existing specifications whenever
reasonable and possible.

The working group will also serve as a venue for ongoing discussions
on other topics related to the more complete list outlined above.
Additional related milestones may be added in the future via a
rechartering operation.

Note: As may be obvious from its official name above, this particular
working group will not work on IPv4 over IEEE 802.15.4 specifications.
Given the limitations of the target devices, dual-stack deployments
are not practical. Because of its higher potential for header
compression, its support for the huge number of devices expected and
of cleanly built-in features such as address autoconfiguration, IPv6
is the exclusive focus of the working group.

Goals and Milestones:

Mar 05 Working group last call on draft-ietf-lowpan-goals-assumptions-xx.txt
Apr 05 Submit draft-ietf-lowpan-goals-assumptions-xx.txt to IESG for consideration of publication as Informational
May 05 Working Group Last Call on draft-ietf-lowpan-ipv6-over-802.15.4-xx.txt
Jul 05 Submit draft-ietf-lowpan-ipv6-over-802.15.4-xx.txt to IESG for consideration of publication as Proposed Standard

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<div>draft-ietf-6lowpan-format-01.txt section 8: </div>
<div>&nbsp;</div>
<div>"Given the very limited packet sizes, it is highly desirable
to<BR>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; integrate layer 2 with layer 3
compression, something typically<BR>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; not
done."</div>
<div>&nbsp;</div>
<div>Actually link-layer assist is quite commonly&nbsp;done - see:</div>
<div><BR>RFC 3242 - RObust Header Compression (ROHC): A Link-Layer
Assisted Profile for IP/UDP/RTP</div>
<div>&nbsp;</div>
<div>Also, I have a draft written on point-to-multipoint header
compression that you may find useful for this section. </div>
<div>&nbsp;</div>
<div>-David Green</div>



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From 6lowpan-bounces@ietf.org Sun Nov 06 23:48:01 2005
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Lowpanners,

I have put up an updated agenda on the 6lowpan wiki:

http://6lowpan.tzi.org/6lowpan_20at_20IETF_2064

Speakers:

Please make sure I have your presentation materials by 11:00 PST so I  
can upload them to the materials tracker site
(https://onsite.ietf.org/public/meeting_materials.cgi?meeting_num=64)  
before the meeting starts.

Thanks!

Gruesse, Carsten


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Date: Mon, 7 Nov 2005 01:17:11 -0800 (PST)
From: gabriel montenegro <itijibox-6lowpan@yahoo.com>
Subject: Re: [6lowpan] Comments on draft-ietf-6lowpan-format-01 Header
	Compression
To: David Green <davegreen@6now.org>, 6lowpan@ietf.org
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I wrote that based on a conversation a while back with Carsten (before he was chair) 
in which he said this was not typically done. 

Carsten, care to elaborate?

As for the effect on the draft, we can just delete this text if there's any objection.
It was just meant as background info and has no normative weight whatsoever.

-gabriel

--- David Green <davegreen@6now.org> wrote:


---------------------------------
draft-ietf-6lowpan-format-01.txt section 8: 
 
"Given the very limited packet sizes, it is highly desirableto
      integrate layer 2 with layer 3compression, something typically
      notdone."
 
Actually link-layer assist is quite commonly done - see:

RFC 3242 - RObust Header Compression (ROHC): A Link-LayerAssisted Profile for IP/UDP/RTP
 
Also, I have a draft written on point-to-multipoint headercompression that you may find
useful for this section. 
 
-David Green
> _______________________________________________
> 6lowpan mailing list
> 6lowpan@ietf.org
> https://www1.ietf.org/mailman/listinfo/6lowpan
> 


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Subject: [6lowpan] Unofficial overflow meeting Tuesday morning 8 am,
	pending AD approval
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Lowpanners,

today we had a bad case of agenda overflow.
While we managed to cover all items that are immediately related to  
our chartered work, there is some interesting input on future work  
that we couldn't look at:

Routing protocol comparison (Kim/Park, 15 min)
	draft-daniel-6lowpan-load-adhoc-routing
	draft-montenegro-6lowpan-dymo-low-routing

6lowpan Evaluation results (Kim/Park, 15 min)
	draft-daniel-6lowpan-load-adhoc-routing
	draft-daniel-6lowpan-hilow-hierarchical-routing
	draft-daniel-6lowpan-sslp
	draft-daniel-6lowpan-interoperability

The slides are already at the meeting materials site, https:// 
onsite.ietf.org/public/meeting_materials.cgi?meeting_num=64, item  
"routing protocols comparison" (direct link is right now: http:// 
onsite.ietf.org/proceedings/05nov/slides/6lowpan-3.pdf).

Pending AD approval (which I herewith request), a couple of  
lowpanners interested in this will meet Tuesday at 8 am sharp in room  
Cypress to look at this presentation.
We have until 8:30, at which time we have to make room for the SASL  
WG meeting.

Also, I would like to report that we had a quite productive hallway  
meeting on the security considerations section of the problem  
statement document, and Nandu is planning to submit an updated  
version to the mailing list Tuesday by 5pm.  Some of us will meet in  
the lobby area at 8 am Wednesday to discuss this some more.

Gruesse, Carsten


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From 6lowpan-bounces@ietf.org Wed Nov 09 12:36:54 2005
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Subject: [6lowpan] Re: Security considerations section of problem statement
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Lowpanners,

a small editing group met in the Westin Bayshore lobby this morning,  
discussing the security considerations section of the problem  
statement document.

The most recent result of the editing is always at

http://www.writely.com/View.aspx?docid=adt3cwpc9qgf

Below is a current snapshot.

Quick comments would be appreciated, as we really want to close this  
remaining issue on the problem statement document.
(If you want to fix things directly on the Writely page, send me mail.)

Gruesse, Carsten


Security Considerations

6lowpan applications often require confidentiality and integrity  
protection.
This can be provided at the application or transport level, at the  
network layer, and/or at the link layer, i.e. within the 6lowpan set  
of specifications.
In all these cases, 6LoWPAN constraints will influence the choice of  
a particular protocol. Some of the more relevant constraints are  
small code size, low power operation, low complexity, and small  
bandwidth requirements.

It is understandable that these constraints have associated  
tradeoffs. Thus a threat model for 6LoWPAN devices needs to be first  
developed in order to weight any risks against the cost of security  
and at the same time make meaningful assumptions and  
simplifications.  Some examples for threats that would be considered  
are man in the middle attacks, denial of service attacks.

A separate set of security considerations might apply to  
bootstrapping a 6lowpan device into the network, in particular  
initial key establishment processes. This is generally involved with  
other application level transactions and may rely on an application- 
specific trust model; thus it will not be part of 6LoWPAN. Some  
choices may be to use out of band communication techniques such as  
USB, infrared or NFC (Near Field Communication) for the initial key  
establishment.

After the initial key establishment, subsequent key management  
protocols would fall under the purview of 6LoWPAN. In order to be  
able to select (or design) this next set of protocols, there needs to  
be a common model of the keying material created by the initial key  
establishment. There are a few cryptographic protocols to choose  
from. It is to be seen if the protocols available as part of IPsec  
meet the constraints of 6LoWPAN.

One argument for using link layer security is that most IEEE 802.15.4  
chips already have support for AES link layer security.  AES is a  
block cipher operating on blocks of fixed length, i.e., 128 bits. To  
encrypt longer messages, several modes of operation may be used. The  
earliest modes described, such as ECB, CBC, OFB and CFB provide only  
confidentiality, and this does not ensure message integrity. Other  
modes have been designed which ensure both confidentiality and  
message integrity, such as CCM mode, EAX mode and OCB mode. 6LoWPAN  
could choose to operate in one of the modes of operation, but it is  
desirable to utilize as much of link level security as possible and  
build upon it.

For network layer security, two models are applicable: end-to-end  
security, e.g. using IPsec transport mode, or security that is  
limited to the wireless portion of the network, e.g. using a security  
gateway and IPsec tunnel mode.  The disadvantage of the latter is the  
larger header size, which is significant at the 6lowpan frame MTUs.  
To simplify 6lowpan implementations, it would be beneficial to  
identify a preferred set of ciphersuites that are appropriate given  
the 6lowpan constraints.



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From 6lowpan-bounces@ietf.org Wed Nov 09 14:08:31 2005
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>
> For network layer security, two models are applicable: end-to-end  
> security, e.g. using IPsec transport mode, or security that is  
> limited to the wireless portion of the network, e.g. using a security  
> gateway and IPsec tunnel mode.  The disadvantage of the latter is the  
> larger header size, which is significant at the 6lowpan frame MTUs.  
> To simplify


I am not in favor of  security gateway, but if we do, it will not 
necessarily increase the
packet overhead of lowpan  becuase I assume the security gateway will be 
at the edge
of the lowpan network - right ?
If we implement IPSec tunnel mode - in lowpan then there is a 
significant overhead  which
is not desirtable.  Should we even consider IPSec tunnel mode within the 
6lowpan network?  Or does the above mean that  the IPSec tunnel at the 
security gateway?

In conjunction with IPSec, we also need to mention that 6lowpan will 
need to choose an
appropriate key-management scheme applicable for 6lowpan characteristics.

Sorry, I don't have  a replacement text prepared to provide right away.

Regards,
-Samita

> 6lowpan implementations, it would be beneficial to  identify a 
> preferred set of ciphersuites that are appropriate given  the 6lowpan 
> constraints.
>
>
>
> _______________________________________________
> 6lowpan mailing list
> 6lowpan@ietf.org
> https://www1.ietf.org/mailman/listinfo/6lowpan




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From 6lowpan-bounces@ietf.org Wed Nov 09 17:02:41 2005
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From: Carsten Bormann <cabo@tzi.org>
Subject: Re: [6lowpan] Re: Security considerations section of problem statement
Date: Wed, 9 Nov 2005 14:02:12 -0800
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>> For network layer security, two models are applicable: end-to-end   
>> security, e.g. using IPsec transport mode, or security that is   
>> limited to the wireless portion of the network, e.g. using a  
>> security  gateway and IPsec tunnel mode.  The disadvantage of the  
>> latter is the  larger header size, which is significant at the  
>> 6lowpan frame MTUs.  To simplify
>
>
> I am not in favor of  security gateway, but if we do, it will not  
> necessarily increase the
> packet overhead of lowpan  becuase I assume the security gateway  
> will be at the edge
> of the lowpan network - right ?

The security gateway is at the edge and converts unsecured packets on  
the outside into secured packets on the inside by encapsulating them  
in ESP.
This is called tunnel mode, so the whole packet is encapsulated, and  
we finally have two IP headers.
The inner IP header, as it is protected (integrity protected and  
encrypted) is not subject to 6lowpan header compression, unless we  
invent a new scheme for compressing within ESP (but see also draft- 
ertekin-rqts-hcoipsec-01.txt).

> If we implement IPSec tunnel mode - in lowpan then there is a  
> significant overhead  which
> is not desirtable.  Should we even consider IPSec tunnel mode  
> within the 6lowpan network?  Or does the above mean that  the IPSec  
> tunnel at the security gateway?

Well, it starts at the security gateway and ends at the 6lowpan  
device in order to secure the 6lowpan part of the path.

In effect, we are making the life of the 6lowpan device harder in  
order to make the life of the extra-6lowpan system easier.
Not a tradeoff I particularly like, which is why I prefer end-to-end  
security (transport mode).

> In conjunction with IPSec, we also need to mention that 6lowpan  
> will need to choose an
> appropriate key-management scheme applicable for 6lowpan  
> characteristics.

Right.
Bob proposed looking at IKEv2 and finding a suitable profile (subset)  
that is small enough implementable in 6lowpan devices.

Gruesse, Carsten


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From 6lowpan-bounces@ietf.org Wed Nov 16 00:51:36 2005
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From: Geoff Mulligan <geoff@mulligan.com>
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Subject: [6lowpan] 6lowpan interim meeting
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At this last IETF a number of 6lowpan participants indicated that we
should consider holding an interim meeting to spend some significant
time and effort working out some of the details of the format document -
the problem document should hopefully be somewhat finished before the
end of this month.

We have a couple of suggestions for when and where to hold the meeting:
    1. In conjunction with the 802.* interim meeting in Hawaii - Jan 15
to 20.
    2. Chicago either before sometime during the week of the 9th or
after during the week of the 23rd.

In order to hold a interim meeting we need to give something like 6
weeks notice and it need to be held like 6 week before the next ietf.
January is the appropriate month.  Now when and where.

If we decide to hold it in or around Chicago, Invensys can sponsor the
meeting site.  Another option would be to volunteer Intel to sponsor it
in the SF Bay area or Portland or Microsoft in Washington, though
Chicago is probably most central.

If we choose to coincide with IEEE in Hawaii, I can ask if we can get
some meeting space in or near the IEEE meeting hotel.

One other option is the during the IEEE Radio and Wireless Symposium Jan
17-19 in San Diego.

Please let me know you thoughts on this ASAP.

	geoff



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From 6lowpan-bounces@ietf.org Wed Nov 16 01:48:18 2005
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Date: Tue, 15 Nov 2005 22:50:13 -0800
From: Soohong Daniel Park <soohong.park@samsung.com>
Subject: Re: [6lowpan] 6lowpan interim meeting
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Good to hear your announcement quickly. Thanks Geoff. 

I am leaning to Hawaii just before 802 interim.

Regards,

Daniel (Soohong Daniel Park)
Mobile Platform Laboratory, SAMSUNG Electronics.

----- Original Message ----- 
From: "Geoff Mulligan" <geoff@mulligan.com>
To: "6lowpan" <6lowpan@ietf.org>
Sent: Tuesday, November 15, 2005 9:51 PM
Subject: [6lowpan] 6lowpan interim meeting


> At this last IETF a number of 6lowpan participants indicated that we
> should consider holding an interim meeting to spend some significant
> time and effort working out some of the details of the format document -
> the problem document should hopefully be somewhat finished before the
> end of this month.
> 
> We have a couple of suggestions for when and where to hold the meeting:
>     1. In conjunction with the 802.* interim meeting in Hawaii - Jan 15
> to 20.
>     2. Chicago either before sometime during the week of the 9th or
> after during the week of the 23rd.
> 
> In order to hold a interim meeting we need to give something like 6
> weeks notice and it need to be held like 6 week before the next ietf.
> January is the appropriate month.  Now when and where.
> 
> If we decide to hold it in or around Chicago, Invensys can sponsor the
> meeting site.  Another option would be to volunteer Intel to sponsor it
> in the SF Bay area or Portland or Microsoft in Washington, though
> Chicago is probably most central.
> 
> If we choose to coincide with IEEE in Hawaii, I can ask if we can get
> some meeting space in or near the IEEE meeting hotel.
> 
> One other option is the during the IEEE Radio and Wireless Symposium Jan
> 17-19 in San Diego.
> 
> Please let me know you thoughts on this ASAP.
> 
> geoff
> 
> 
> 
> _______________________________________________
> 6lowpan mailing list
> 6lowpan@ietf.org
> https://www1.ietf.org/mailman/listinfo/6lowpan
> 
> 

_______________________________________________
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Subject: RE: [6lowpan] 6lowpan interim meeting
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From: "Schumacher Christian Peter Pii" <schumacher@danfoss.com>
To: "Geoff Mulligan" <geoff@mulligan.com>, "6lowpan" <6lowpan@ietf.org>
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Hi Geoff.

I'd prefer Chicago for travel related reasons, but I'm open for both =
destinations.

Regards
Christian


-----Original Message-----
From: 6lowpan-bounces@ietf.org on behalf of Geoff Mulligan
Sent: Wed 11/16/2005 6:51 AM
To: 6lowpan
Subject: [6lowpan] 6lowpan interim meeting
=20
At this last IETF a number of 6lowpan participants indicated that we
should consider holding an interim meeting to spend some significant
time and effort working out some of the details of the format document -
the problem document should hopefully be somewhat finished before the
end of this month.

We have a couple of suggestions for when and where to hold the meeting:
    1. In conjunction with the 802.* interim meeting in Hawaii - Jan 15
to 20.
    2. Chicago either before sometime during the week of the 9th or
after during the week of the 23rd.

In order to hold a interim meeting we need to give something like 6
weeks notice and it need to be held like 6 week before the next ietf.
January is the appropriate month.  Now when and where.

If we decide to hold it in or around Chicago, Invensys can sponsor the
meeting site.  Another option would be to volunteer Intel to sponsor it
in the SF Bay area or Portland or Microsoft in Washington, though
Chicago is probably most central.

If we choose to coincide with IEEE in Hawaii, I can ask if we can get
some meeting space in or near the IEEE meeting hotel.

One other option is the during the IEEE Radio and Wireless Symposium Jan
17-19 in San Diego.

Please let me know you thoughts on this ASAP.

	geoff



_______________________________________________
6lowpan mailing list
6lowpan@ietf.org
https://www1.ietf.org/mailman/listinfo/6lowpan


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<P><FONT SIZE=3D2>Hi Geoff.<BR>
<BR>
I'd prefer Chicago for travel related reasons, but I'm open for both =
destinations.<BR>
<BR>
Regards<BR>
Christian<BR>
<BR>
<BR>
-----Original Message-----<BR>
From: 6lowpan-bounces@ietf.org on behalf of Geoff Mulligan<BR>
Sent: Wed 11/16/2005 6:51 AM<BR>
To: 6lowpan<BR>
Subject: [6lowpan] 6lowpan interim meeting<BR>
<BR>
At this last IETF a number of 6lowpan participants indicated that we<BR>
should consider holding an interim meeting to spend some significant<BR>
time and effort working out some of the details of the format document =
-<BR>
the problem document should hopefully be somewhat finished before =
the<BR>
end of this month.<BR>
<BR>
We have a couple of suggestions for when and where to hold the =
meeting:<BR>
&nbsp;&nbsp;&nbsp; 1. In conjunction with the 802.* interim meeting in =
Hawaii - Jan 15<BR>
to 20.<BR>
&nbsp;&nbsp;&nbsp; 2. Chicago either before sometime during the week of =
the 9th or<BR>
after during the week of the 23rd.<BR>
<BR>
In order to hold a interim meeting we need to give something like 6<BR>
weeks notice and it need to be held like 6 week before the next =
ietf.<BR>
January is the appropriate month.&nbsp; Now when and where.<BR>
<BR>
If we decide to hold it in or around Chicago, Invensys can sponsor =
the<BR>
meeting site.&nbsp; Another option would be to volunteer Intel to =
sponsor it<BR>
in the SF Bay area or Portland or Microsoft in Washington, though<BR>
Chicago is probably most central.<BR>
<BR>
If we choose to coincide with IEEE in Hawaii, I can ask if we can =
get<BR>
some meeting space in or near the IEEE meeting hotel.<BR>
<BR>
One other option is the during the IEEE Radio and Wireless Symposium =
Jan<BR>
17-19 in San Diego.<BR>
<BR>
Please let me know you thoughts on this ASAP.<BR>
<BR>
&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; geoff<BR>
<BR>
<BR>
<BR>
_______________________________________________<BR>
6lowpan mailing list<BR>
6lowpan@ietf.org<BR>
<A =
HREF=3D"https://www1.ietf.org/mailman/listinfo/6lowpan">https://www1.ietf=
.org/mailman/listinfo/6lowpan</A><BR>
<BR>
</FONT>
</P>

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_______________________________________________
6lowpan mailing list
6lowpan@ietf.org
https://www1.ietf.org/mailman/listinfo/6lowpan

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From 6lowpan-bounces@ietf.org Wed Nov 16 12:23:21 2005
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Date: Wed, 16 Nov 2005 09:23:08 -0800 (PST)
From: gabriel montenegro <itijibox-6lowpan@yahoo.com>
Subject: Re: [6lowpan] 6lowpan interim meeting
To: Geoff Mulligan <geoff@mulligan.com>, 6lowpan <6lowpan@ietf.org>
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I'd prefer the week of the 23rd. No real preference as to location, and yes,
Redmond would be a possibility if folks don't find it too inconvenient.

-gabriel

--- Geoff Mulligan <geoff@mulligan.com> wrote:

> At this last IETF a number of 6lowpan participants indicated that we
> should consider holding an interim meeting to spend some significant
> time and effort working out some of the details of the format document -
> the problem document should hopefully be somewhat finished before the
> end of this month.
> 
> We have a couple of suggestions for when and where to hold the meeting:
>     1. In conjunction with the 802.* interim meeting in Hawaii - Jan 15
> to 20.
>     2. Chicago either before sometime during the week of the 9th or
> after during the week of the 23rd.
> 
> In order to hold a interim meeting we need to give something like 6
> weeks notice and it need to be held like 6 week before the next ietf.
> January is the appropriate month.  Now when and where.
> 
> If we decide to hold it in or around Chicago, Invensys can sponsor the
> meeting site.  Another option would be to volunteer Intel to sponsor it
> in the SF Bay area or Portland or Microsoft in Washington, though
> Chicago is probably most central.
> 
> If we choose to coincide with IEEE in Hawaii, I can ask if we can get
> some meeting space in or near the IEEE meeting hotel.
> 
> One other option is the during the IEEE Radio and Wireless Symposium Jan
> 17-19 in San Diego.
> 
> Please let me know you thoughts on this ASAP.
> 
> 	geoff
> 
> 
> 
> _______________________________________________
> 6lowpan mailing list
> 6lowpan@ietf.org
> https://www1.ietf.org/mailman/listinfo/6lowpan
> 


_______________________________________________
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https://www1.ietf.org/mailman/listinfo/6lowpan



From 6lowpan-bounces@ietf.org Thu Nov 17 11:36:42 2005
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From: Ki-Hyung Kim <kkim86@ajou.ac.kr>
To: "'Geoff Mulligan'" <geoff@mulligan.com>, "'6lowpan'" <6lowpan@ietf.org>
Subject: RE: [6lowpan] 6lowpan interim meeting
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Hi Geoff,
I have no preference as to the location.


--
Ki-Hyung Kim
Associate Professor
Division of Information and Computer Engineering,
Ajou University, Suwon, Korea 442-749
Tel: +82-31-219-2433, Cel: +82-17-760-2551,  Fax: +82-31-219-2433
http://ilab.ajou.ac.kr/kkim86/index.htm  

> -----Original Message-----
> From: 6lowpan-bounces@ietf.org [mailto:6lowpan-bounces@ietf.org] On Behalf
> Of Geoff Mulligan
> Sent: Wednesday, November 16, 2005 2:51 PM
> To: 6lowpan
> Subject: [6lowpan] 6lowpan interim meeting
> 
> 
> At this last IETF a number of 6lowpan participants indicated that we
> should consider holding an interim meeting to spend some significant
> time and effort working out some of the details of the format document -
> the problem document should hopefully be somewhat finished before the
> end of this month.
> 
> We have a couple of suggestions for when and where to hold the meeting:
>     1. In conjunction with the 802.* interim meeting in Hawaii - Jan 15
> to 20.
>     2. Chicago either before sometime during the week of the 9th or
> after during the week of the 23rd.
> 
> In order to hold a interim meeting we need to give something like 6
> weeks notice and it need to be held like 6 week before the next ietf.
> January is the appropriate month.  Now when and where.
> 
> If we decide to hold it in or around Chicago, Invensys can sponsor the
> meeting site.  Another option would be to volunteer Intel to sponsor it
> in the SF Bay area or Portland or Microsoft in Washington, though
> Chicago is probably most central.
> 
> If we choose to coincide with IEEE in Hawaii, I can ask if we can get
> some meeting space in or near the IEEE meeting hotel.
> 
> One other option is the during the IEEE Radio and Wireless Symposium Jan
> 17-19 in San Diego.
> 
> Please let me know you thoughts on this ASAP.
> 
> 	geoff
> 
> 
> 
> _______________________________________________
> 6lowpan mailing list
> 6lowpan@ietf.org
> https://www1.ietf.org/mailman/listinfo/6lowpan


_______________________________________________
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https://www1.ietf.org/mailman/listinfo/6lowpan



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Thanks Geoff. Any place is fine with me as well.=20

Is the goal to finalize and complete the two outstanding documents in
the meeting?

Regards,
Nandu

-----Original Message-----
From: 6lowpan-bounces@ietf.org [mailto:6lowpan-bounces@ietf.org] On
Behalf Of Geoff Mulligan
Sent: Tuesday, November 15, 2005 9:51 PM
To: 6lowpan
Subject: [6lowpan] 6lowpan interim meeting

At this last IETF a number of 6lowpan participants indicated that we
should consider holding an interim meeting to spend some significant
time and effort working out some of the details of the format document -
the problem document should hopefully be somewhat finished before the
end of this month.

We have a couple of suggestions for when and where to hold the meeting:
    1. In conjunction with the 802.* interim meeting in Hawaii - Jan 15
to 20.
    2. Chicago either before sometime during the week of the 9th or
after during the week of the 23rd.

In order to hold a interim meeting we need to give something like 6
weeks notice and it need to be held like 6 week before the next ietf.
January is the appropriate month.  Now when and where.

If we decide to hold it in or around Chicago, Invensys can sponsor the
meeting site.  Another option would be to volunteer Intel to sponsor it
in the SF Bay area or Portland or Microsoft in Washington, though
Chicago is probably most central.

If we choose to coincide with IEEE in Hawaii, I can ask if we can get
some meeting space in or near the IEEE meeting hotel.

One other option is the during the IEEE Radio and Wireless Symposium Jan
17-19 in San Diego.

Please let me know you thoughts on this ASAP.

	geoff



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From 6lowpan-bounces@ietf.org Thu Nov 17 17:58:58 2005
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Hi Geoff,

What is the primary agenda for the interim meeting?
Are we expecting  usual IETF goers to be present in the meeting?
What  would we try to accomplish out of this meeting?
I assume the meeting will not be more than one-or two days.
I'd prefer somewhere close by - Washington, Oregon, or even better if it 
is in the
bay area.

Thanks,
-Samita


Kushalnagar, Nandakishore wrote:

>Thanks Geoff. Any place is fine with me as well. 
>
>Is the goal to finalize and complete the two outstanding documents in
>the meeting?
>
>Regards,
>Nandu
>
>-----Original Message-----
>From: 6lowpan-bounces@ietf.org [mailto:6lowpan-bounces@ietf.org] On
>Behalf Of Geoff Mulligan
>Sent: Tuesday, November 15, 2005 9:51 PM
>To: 6lowpan
>Subject: [6lowpan] 6lowpan interim meeting
>
>At this last IETF a number of 6lowpan participants indicated that we
>should consider holding an interim meeting to spend some significant
>time and effort working out some of the details of the format document -
>the problem document should hopefully be somewhat finished before the
>end of this month.
>
>We have a couple of suggestions for when and where to hold the meeting:
>    1. In conjunction with the 802.* interim meeting in Hawaii - Jan 15
>to 20.
>    2. Chicago either before sometime during the week of the 9th or
>after during the week of the 23rd.
>
>In order to hold a interim meeting we need to give something like 6
>weeks notice and it need to be held like 6 week before the next ietf.
>January is the appropriate month.  Now when and where.
>
>If we decide to hold it in or around Chicago, Invensys can sponsor the
>meeting site.  Another option would be to volunteer Intel to sponsor it
>in the SF Bay area or Portland or Microsoft in Washington, though
>Chicago is probably most central.
>
>If we choose to coincide with IEEE in Hawaii, I can ask if we can get
>some meeting space in or near the IEEE meeting hotel.
>
>One other option is the during the IEEE Radio and Wireless Symposium Jan
>17-19 in San Diego.
>
>Please let me know you thoughts on this ASAP.
>
>	geoff
>
>
>
>_______________________________________________
>6lowpan mailing list
>6lowpan@ietf.org
>https://www1.ietf.org/mailman/listinfo/6lowpan
>
>_______________________________________________
>6lowpan mailing list
>6lowpan@ietf.org
>https://www1.ietf.org/mailman/listinfo/6lowpan
>
>  
>



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