Subject: [AAA-WG]: 3rd Diameter Bakeoff summary

From: "Kevin Purser" <[email-masked]>
Date: Thu, 8 Nov 2001 15:02:57 -0800

Hello all,

For all interested parties, this document serves to summarize the results of
the interoperability testing which occurred between the 5 vendors who
attended the recent 3rd Diameter Bakeoff, hosted by Ericsson in Berkeley,
CA, October 22-26, 2001.

The event ran quite smoothly, and thanks to all the vendors who attended
with excellent prototypes!

-Kev