Subject: [NEXTEL-1] Motorola i30sx iDEN Phone Teardown / Disassembly Reverse-Engineering Report

From: [email-masked]
Date: Mon, 07 Jul 2003 05:40:34 -0400

Someone in R&D had asked for the Teardown on this phone previously. I hope this
helps.

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Teardown / Disassembly Reverse-Engineering Report

The Motorola i30sx is an entry-level mobile phone that uses the
iDEN protocol (Motorola’s variant on TDMA technology) which also
supports Nextel’s DirectConnect® push-to-talk capability.

Pub. date
File Size
# of pages
Price
June 2003
17 Mbytes
54 pages
$1,950*
* This teardown / disassembly report is included in the
Wireless Terminals Channel license, or can be purchased
individually at this price (subject to change without notice). To
order, click here.

Teardown / Disassembly Report Contents:
(Click here for Table of Contents, pdf file)

* Detailed external and internal photos
* Detailed step-by-by step disassembly reverse-engineering
process
* Simplified Block Diagram
* Power measurements
* Circuit board and packaging metrics
* Complete parts lists and component count
* Manufacturing cost analysis
* Description of most interesting electronic features and
packaging concepts

http://www.portelligent.com/channels/wireless/Motorola-i30sx.asp
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Motorola i30sx iDEN Phone

Teardown / Disassembly Reverse-Engineering Report

The Motorola i30sx is an entry-level mobile phone that uses the iDEN protocol (Motorola’s variant on TDMA technology) which also supports Nextel’s DirectConnect® push-to-talk capability. Like most mobile phones, the i30sx has a microbrowser for Internet access including sending and receiving e-mail. Other features of the i30sx include voice dialing and recording, a 250 entry phonebook and predictive text message input.

Pub. date

File Size

# of pages

Price

June 2003

17 Mbytes

54 pages

$1,950*

* This teardown / disassembly report is included in the Wireless Terminals Channel license, or can be purchased individually at this price (subject to change without notice). To order, click here.

Teardown / Disassembly Report Contents:

(Click here for Table of Contents, pdf file)

* Detailed external and internal photos

* Detailed step-by-by step disassembly reverse-engineering process

* Simplified Block Diagram

* Power measurements

* Circuit board and packaging metrics

* Complete parts lists and component count

* Manufacturing cost analysis

* Description of most interesting electronic features and packaging concepts

Download Teardown / Disassembly Reverse-Engineering Report

(requires username and password)

Download BOM (Bill of Materials)

(requires username and password)

The Teardown Report is large due to the high-resolution graphics, and may take awhile to download. It requires Acrobat Reader 4.0*. Please right-click on the "Full Report" link and select "Save Target As ... " or "Save Link As ... " to download the file for offline viewing (faster than in-browser viewing). Mac users: Click and Hold your mouse button.

The BOM (Bill of Materials) spreadsheet includes ICs, discretes, connectors, and modules for all components, substrate cost, and Design for Manufacturing and Design for Assembly metrics.

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